Encapsulation of organic electronic devices using adsorbent loaded adhesives
A Standard patent application filed on 26 November 2002 credited to Mccormick, Fred B.
;
Baude, Paul F.
;
Haase, Michael A.
Details
Application number :
2002357769
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Encapsulation of organic electronic devices using adsorbent loaded adhesives
Inventor :
Mccormick, Fred B.
;
Baude, Paul F.
;
Haase, Michael A.
Agent name :
Address for service :
Filing date :
26 November 2002
Associated companies :
Applicant name :
3M INNOVATIVE PROPERTIES COMPANY
Applicant address :
3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427