Method for improving electromigration performance of metallization features through multiple depositions of binary alloys
A Standard patent application filed on 11 December 2002 credited to Marathe, Amit P. ; Macdonald, Brian J. ; Wang, Pin-Chin Connie ; Bernard, Joffre F. ; Sanchez, John E. ; Wang, Fei

Details

Application number :

2002357170  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method for improving electromigration performance of metallization features through multiple depositions of binary alloys  

Inventor :

Marathe, Amit P. ; Macdonald, Brian J. ; Wang, Pin-Chin Connie ; Bernard, Joffre F. ; Sanchez, John E. ; Wang, Fei  

Agent name :

 

Address for service :

 

Filing date :

11 December 2002  

Associated companies :

 

Applicant name :

ADVANCED MICRO DEVICES, INC.  

Applicant address :

One AMD Place, Mail Stop 68, P.O. Box 3453, Sunnyvale, CA 94088-3453  

Old name :

 

Original Source :

Go