Details

Application number :
2002357170  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for improving electromigration performance of metallization features through multiple depositions of binary alloys  
Inventor :
Marathe, Amit P. ; Macdonald, Brian J. ; Wang, Pin-Chin Connie ; Bernard, Joffre F. ; Sanchez, John E. ; Wang, Fei  
Agent name :
 
Address for service :
 
Filing date :
11 December 2002  
Associated companies :
 
Applicant name :
ADVANCED MICRO DEVICES, INC.  
Applicant address :
One AMD Place, Mail Stop 68, P.O. Box 3453, Sunnyvale, CA 94088-3453  
Old name :
 
Original Source :
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