Details

Application number :
2002356887  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification  
Inventor :
Liniger, Eric G. ; Gates, Stephen M. ; Lane, Michael W. ; Fitzsimmons, John A.  
Agent name :
 
Address for service :
 
Filing date :
31 October 2002  
Associated companies :
 
Applicant name :
INTERNATIONAL BUSINESS MACHINES CORPORATION  
Applicant address :
New Orchard Road, Armonk, NY 10504  
Old name :
 
Original Source :
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