Flip chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
A Standard patent application filed on 22 July 2002 credited to Mohammed, Anwar
;
Slater, David
;
Negley, Gerry
;
Andrews, Peter
;
Edmond, John
;
Raffetto, Mark
;
Bharathan, Jayesh
Details
Application number :
2002355134
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Flip chip bonding of light emitting devices and light emitting devices suitable for flip-chip bonding
Inventor :
Mohammed, Anwar
;
Slater, David
;
Negley, Gerry
;
Andrews, Peter
;
Edmond, John
;
Raffetto, Mark
;
Bharathan, Jayesh