Method of laminating circuit board and method of forming insulation layer, multilayer printed wiring board and production method therefor and adhesion film for multilayer printed wiring board
A Standard patent application filed on 28 November 2002 credited to Yokota, Tadahiko ; Nakamura, Shigeo

Details

Application number :

2002355051  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method of laminating circuit board and method of forming insulation layer, multilayer printed wiring board and production method therefor and adhesion film for multilayer printed wiring board  

Inventor :

Yokota, Tadahiko ; Nakamura, Shigeo  

Agent name :

 

Address for service :

 

Filing date :

28 November 2002  

Associated companies :

 

Applicant name :

AJINOMOTO CO., INC.  

Applicant address :

15-1, Kyobashi 1-chome, Chuo-ku, Tokyo 104-8315  

Old name :

 

Original Source :

Go  

Same Inventor

• Film for circuit board