Details

Application number :
2002355051  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method of laminating circuit board and method of forming insulation layer, multilayer printed wiring board and production method therefor and adhesion film for multilayer printed wiring board  
Inventor :
Yokota, Tadahiko ; Nakamura, Shigeo  
Agent name :
 
Address for service :
 
Filing date :
28 November 2002  
Associated companies :
 
Applicant name :
AJINOMOTO CO., INC.  
Applicant address :
15-1, Kyobashi 1-chome, Chuo-ku, Tokyo 104-8315  
Old name :
 
Original Source :
Go  

Same Inventor