Epoxy resin molding material for encapsulation and electronic components and devices
A Standard patent application filed on 11 December 2002 credited to Abe, Hidenori ; Fujii, Masanobu ; Miyata, Tomohiro ; Hayashi, Tomohiro ; Ikezawa, Ryouichi

Details

Application number :

2002354468  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Epoxy resin molding material for encapsulation and electronic components and devices  

Inventor :

Abe, Hidenori ; Fujii, Masanobu ; Miyata, Tomohiro ; Hayashi, Tomohiro ; Ikezawa, Ryouichi  

Agent name :

 

Address for service :

 

Filing date :

11 December 2002  

Associated companies :

 

Applicant name :

HITACHI CHEMICAL CO., LTD.  

Applicant address :

1-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0449  

Old name :

 

Original Source :

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