Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes
A Standard patent application filed on 06 November 2002 credited to Not Given

Details

Application number :

2002350152  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Integrated dry-wet processing apparatus and method for removing material on semiconductor wafers using dry-wet processes  

Inventor :

Not Given  

Agent name :

 

Address for service :

 

Filing date :

06 November 2002  

Associated companies :

 

Applicant name :

YONG, Bae, Kim  

Applicant address :

1114 Steeplechase Lane, Cupertino, CA 95014  

Old name :

 

Original Source :

Go  

Same Inventor

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