Process of adhering titanium metal layer to substrate surface
A Standard patent application filed on 05 November 2002 credited to Sun, Hueihsin
;
Chen, Chingping
Details
Application number :
2002349416
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Process of adhering titanium metal layer to substrate surface
Inventor :
Sun, Hueihsin
;
Chen, Chingping
Agent name :
Address for service :
Filing date :
05 November 2002
Associated companies :
Applicant name :
CHEN, Chingping
Applicant address :
5F, No. 57, Sec. 3, Min-Sheng East Road, Taipei, Taiwan