Method of bonding a window to a substrate without a primer
A Standard patent application filed on 26 November 2002 credited to Samurkas, Andon
;
Wu, Ziyan
;
Tobin, Sean C.
;
Heberer, Daniel P.
Details
Application number :
2002348248
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method of bonding a window to a substrate without a primer
Inventor :
Samurkas, Andon
;
Wu, Ziyan
;
Tobin, Sean C.
;
Heberer, Daniel P.
Agent name :
Address for service :
Filing date :
26 November 2002
Associated companies :
Applicant name :
DOW GLOBAL TECHNOLOGIES INC.
Applicant address :
Washington Street, 1790 Building, Midland, MI 48674