Device for packing pressure-sensitive adhesive substrate sections and the use thereof
A Standard patent application filed on 15 January 2000 credited to Theobald, Frank

Details

Application number :
26643  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Device for packing pressure-sensitive adhesive substrate sections and the use thereof  
Inventor :
Theobald, Frank  
Agent name :
HODGKINSON McINNES PATENTS  
Address for service :
Level 21 201 Elizabeth Street SYDNEY NSW 2000  
Filing date :
15 January 2000  
Associated companies :
 
Applicant name :
LTS Lohmann Therapie-Systeme AG  
Applicant address :
Lohmanstrasse 2 D-56626 Andernach Germany  
Old name :
 
Original Source :
Go  

Same Inventor