A component for being subjected to high thermal load during operation and a method for manufacturing such a component
A Standard patent application filed on 15 November 2002 credited to Haggander, Jan
Details
Application number :
2002347745
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
A component for being subjected to high thermal load during operation and a method for manufacturing such a component