Thermal mismatch compensation technique for integrated circuit assemblies
A Standard patent application filed on 05 December 2002 credited to Robillard, Gene A. ; Graney, Robert N. ; Holland, Richard S. ; Marciniec, John W.

Details

Application number :

2002346669  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Thermal mismatch compensation technique for integrated circuit assemblies  

Inventor :

Robillard, Gene A. ; Graney, Robert N. ; Holland, Richard S. ; Marciniec, John W.  

Agent name :

 

Address for service :

 

Filing date :

05 December 2002  

Associated companies :

 

Applicant name :

BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC  

Applicant address :

65 Spit Brook Road, Nashua, NH 03061  

Old name :

 

Original Source :

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