High-density connector assembly with improved mating capability
A Standard patent application filed on 29 November 2002 credited to Mcgowan, Daniel B. ; Fromm, Galen F. ; Nelson, Richard A. ; Sweeney, Kathleen A. ; Avery, Hazelton P.

Details

Application number :
2002346593  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
High-density connector assembly with improved mating capability  
Inventor :
Mcgowan, Daniel B. ; Fromm, Galen F. ; Nelson, Richard A. ; Sweeney, Kathleen A. ; Avery, Hazelton P.  
Agent name :
 
Address for service :
 
Filing date :
29 November 2002  
Associated companies :
 
Applicant name :
MOLEX INCORPORATED  
Applicant address :
2222 Wellington Court, Lisle, IL 60532  
Old name :
 
Original Source :
Go  

Same Inventor