Details
- Application number :
- 2002346147
- Application type :
- Standard
- Application status :
- LAPSED
- Under opposition :
- No
- Proceeding type :
-
- Invention title :
- Substrate treating device and substrate treating method, substrate flattening method
- Inventor :
- Hirayama, Masaki
;
Goto, Tetsuya
;
Ohmi, Tadahiro
;
Sugawa, Shigetoshi
- Agent name :
-
- Address for service :
-
- Filing date :
- 03 July 2002
- Associated companies :
-
- Applicant name :
- OHMI, Tadahiro
- Applicant address :
- 1-17-301, Komegafukuro 2-Chome, Aoba-ku, Sendai-Shi, Miyagi 980-0813
- Old name :
-
- Original Source :
- Go