Details

Application number :
2002344592  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method  
Inventor :
Baba, Daizo ; Hirabayashi, Tatsuo ; Fukuya, Naohito  
Agent name :
 
Address for service :
 
Filing date :
28 October 2002  
Associated companies :
 
Applicant name :
MATSUSHITA ELECTRIC WORKS, LTD.  
Applicant address :
1048, Oaza Kadoma, Kadoma-shi, Osaka 571-8686  
Old name :
 
Original Source :
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