Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method
A Standard patent application filed on 28 October 2002 credited to Baba, Daizo ; Hirabayashi, Tatsuo ; Fukuya, Naohito

Details

Application number :

2002344592  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method  

Inventor :

Baba, Daizo ; Hirabayashi, Tatsuo ; Fukuya, Naohito  

Agent name :

 

Address for service :

 

Filing date :

28 October 2002  

Associated companies :

 

Applicant name :

MATSUSHITA ELECTRIC WORKS, LTD.  

Applicant address :

1048, Oaza Kadoma, Kadoma-shi, Osaka 571-8686  

Old name :

 

Original Source :

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