Integrated equipment set for forming an interconnect on a substrate
A Standard patent application filed on 16 September 2002 credited to Hraiz, Pierre G. ; Parikh, Suketu A. ; Cheung, Robin

Details

Application number :

2002341677  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Integrated equipment set for forming an interconnect on a substrate  

Inventor :

Hraiz, Pierre G. ; Parikh, Suketu A. ; Cheung, Robin  

Agent name :

 

Address for service :

 

Filing date :

16 September 2002  

Associated companies :

 

Applicant name :

APPLIED MATERIALS, INC.  

Applicant address :

3050 Bowers Avenue, Santa Clara, CA 95054  

Old name :

 

Original Source :

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