Laminated model for a multilayer printed circuit wafer blank
A Standard patent application filed on 17 September 2002 credited to Wiemers, Arnold

Details

Application number :

2002339302  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Laminated model for a multilayer printed circuit wafer blank  

Inventor :

Wiemers, Arnold  

Agent name :

 

Address for service :

 

Filing date :

17 September 2002  

Associated companies :

 

Applicant name :

ILFA INDUSTRIEELEKTRONIK UND LEITERPLATTENFERTIGUNG ALLER ART GMBH  

Applicant address :

Lohweg 3, 30559 Hannover  

Old name :

 

Original Source :

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