Defferential connector footprint for a multi-layer circuit board
A Standard patent application filed on 26 April 2002 credited to Sharf, Alexander Michael ; Helster, David Wayne ; Morgan, Chad William ; Rothermel, Brent Ryan

Details

Application number :

2002338599  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Defferential connector footprint for a multi-layer circuit board  

Inventor :

Sharf, Alexander Michael ; Helster, David Wayne ; Morgan, Chad William ; Rothermel, Brent Ryan  

Agent name :

 

Address for service :

 

Filing date :

26 April 2002  

Associated companies :

 

Applicant name :

TYCO ELECTRONICS CORPORATION  

Applicant address :

2901 Fulling Mill Road, Middletown, PA 17057  

Old name :

 

Original Source :

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