Wafer level insulation underfill for die attach
A Standard patent application filed on 27 March 2002 credited to Standing, Martin

Details

Application number :

2002338268  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Wafer level insulation underfill for die attach  

Inventor :

Standing, Martin  

Agent name :

 

Address for service :

 

Filing date :

27 March 2002  

Associated companies :

 

Applicant name :

INTERNATIONAL RECTIFIER CORPORATION  

Applicant address :

233 Kansas Street, El Segundo, CA 90245  

Old name :

 

Original Source :

Go  

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