Details

Application number :
2002338041  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Flux composition for solder, solder paste, and method of soldering  
Inventor :
Nakata, Isao ; Kato, Yukihiro ; Saito, Shun ; Nakasato, Katsumi  
Agent name :
 
Address for service :
 
Filing date :
26 September 2002  
Associated companies :
 
Applicant name :
NOF CORPORATION  
Applicant address :
20-3, Ebisu 4-chome, Shibuya-ku, Tokyo 150-0013  
Old name :
 
Original Source :
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