Method and apparatus for sputter deposition of epilayers with high deposition rate
A Standard patent application filed on 27 September 2002 credited to Chistyakov, Roman
Details
Application number :
2002334713
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method and apparatus for sputter deposition of epilayers with high deposition rate