Encapsulated integrated circuit package and method of manufacturing an integrated circuit package

Application number :: 2002332557
Application type :: Standard
Application status :: LAPSED
Under opposition :: No
Proceeding type :
Invention title :: Encapsulated integrated circuit package and method of manufacturing an integrated circuit package
Inventor :: Keung, Chow Lap ; Fan, Chun Ho ; Cheung, Tsang Kwok ; Mclellan, Neil Robert ; Labeeb, Sadak Thamby ; Combs, Edward G.
Agent name :
Address for service :
Filing date :: 15 August 2002
Associated companies :
Applicant name :: ASAT LIMITED
Applicant address :: QPL Industrial Building,, 138 Texaco Road, Tsuen Wan,, New Territories, Hong Kong
Old name :
Original Source :: Go

Encapsulated integrated circuit package and method of manufacturing an integrated circuit package A Standard patent application filed on 15 August 2002 credited to Keung, Chow Lap ; Fan, Chun Ho ; Cheung, Tsang Kwok ; Mclellan, Neil Robert ; Labeeb, Sadak Thamby ; Combs, Edward G.