Test structures for estimating dishing and erosion effects in copper damascene technology
A Standard patent application filed on 27 September 2002 credited to Stine, Brian E. ; Hess, Christopher ; Decker, Markus ; Weiland, Larg ; Ciplickas, Dennis J.

Details

Application number :

2002331919  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Test structures for estimating dishing and erosion effects in copper damascene technology  

Inventor :

Stine, Brian E. ; Hess, Christopher ; Decker, Markus ; Weiland, Larg ; Ciplickas, Dennis J.  

Agent name :

 

Address for service :

 

Filing date :

27 September 2002  

Associated companies :

 

Applicant name :

PDF SOLUTIONS, INC.  

Applicant address :

Suite 700, 333 West San Carlos, San Jose, CA 95110  

Old name :

 

Original Source :

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