Method for improving bonding of circuit substrates to metal and articles formed thereby
A Standard patent application filed on 21 August 2002 credited to Mcalister, Bryan C.
;
Landi, Vincent R.
;
Neill, John T.
Details
Application number :
2002329794
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method for improving bonding of circuit substrates to metal and articles formed thereby
Inventor :
Mcalister, Bryan C.
;
Landi, Vincent R.
;
Neill, John T.
Agent name :
Address for service :
Filing date :
21 August 2002
Associated companies :
Applicant name :
WORLD PROPERTIES INC.
Applicant address :
Suite 410, 7366 North Lincoln Avenue, Lincolnwood, IL 60646