Die bonder and method for detecting misaligned workpieces
A Standard patent application filed on 05 August 2002 credited to Tan, Chin Hiang ; Radeck, Stephanie Elisabeth Anna ; Gotsis, Franz Michael Anastasius

Details

Application number :

2002328008  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Die bonder and method for detecting misaligned workpieces  

Inventor :

Tan, Chin Hiang ; Radeck, Stephanie Elisabeth Anna ; Gotsis, Franz Michael Anastasius  

Agent name :

 

Address for service :

 

Filing date :

05 August 2002  

Associated companies :

 

Applicant name :

CASEM (ASIA) PTE LTD  

Applicant address :

Blk 5004, Ang Mo Kio Ave 5, #03-12, Techplace II, Singapore 569872  

Old name :

 

Original Source :

Go