Improved chemical mechanical polishing compositions for metal and associated materials and method of using same
A Standard patent application filed on 14 August 2002 credited to Regulski, Cary ; Bernhard, David ; Ma, Ying ; Baum, Thomas H. ; Wojtczak, William ; Verma, Deepak

Details

Application number :

2002326636  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Improved chemical mechanical polishing compositions for metal and associated materials and method of using same  

Inventor :

Regulski, Cary ; Bernhard, David ; Ma, Ying ; Baum, Thomas H. ; Wojtczak, William ; Verma, Deepak  

Agent name :

 

Address for service :

 

Filing date :

14 August 2002  

Associated companies :

 

Applicant name :

ADVANCED TECHNOLOGY MATERIALS, INC.  

Applicant address :

7 Commerce Drive, Danbury, CT 06810  

Old name :

 

Original Source :

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