Adhesive composition and low temperature applicable adhesive sheet
A Standard patent application filed on 27 August 2002 credited to Takamatsu, Yorinobu ; Abe, Hidetoshi

Details

Application number :

2002324807  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Adhesive composition and low temperature applicable adhesive sheet  

Inventor :

Takamatsu, Yorinobu ; Abe, Hidetoshi  

Agent name :

 

Address for service :

 

Filing date :

27 August 2002  

Associated companies :

 

Applicant name :

3M INNOVATIVE PROPERTIES COMPANY  

Applicant address :

3M Center, Post Office Box 33427, Saint Paul, MN 55133-3427  

Old name :

 

Original Source :

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