Details

Application number :
2002324740  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Thermal compensation method and device for circuits with temperature-dependent current sensing elements  
Inventor :
Duduman, Bogdan M. ; Isham, Robert H. ; Harris, Matthew B.  
Agent name :
 
Address for service :
 
Filing date :
20 August 2002  
Associated companies :
 
Applicant name :
INTERSIL AMERICAS INC.  
Applicant address :
675 Trade Zone Boulevard Milpitas, CA 95035 United States of America  
Old name :
 
Original Source :
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