Polishing fluid for metallic film and method for producing semiconductor substrate using the same
A Standard patent application filed on 08 August 2002 credited to Takahashi, Hideaki ; Matsuda, Takayuki ; Miyazaki, Kuon ; Okita, Koshi

Details

Application number :

2002323920  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Polishing fluid for metallic film and method for producing semiconductor substrate using the same  

Inventor :

Takahashi, Hideaki ; Matsuda, Takayuki ; Miyazaki, Kuon ; Okita, Koshi  

Agent name :

 

Address for service :

 

Filing date :

08 August 2002  

Associated companies :

 

Applicant name :

Asahi Kasei Chemicals Corporation  

Applicant address :

1-2, Yurakucho 1 chome Chiyoda-ku, Tokyo 100-8440 Japan  

Old name :

 

Original Source :

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