Improved heat sink for surface mounted power devices
A Standard patent application filed on 22 August 2002 credited to Cook, Alexander ; Isurin, Alexander ; Speck, Stephen D. ; Humphries, John K. ; Campbell, James G.

Details

Application number :

2002323332  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Improved heat sink for surface mounted power devices  

Inventor :

Cook, Alexander ; Isurin, Alexander ; Speck, Stephen D. ; Humphries, John K. ; Campbell, James G.  

Agent name :

 

Address for service :

 

Filing date :

22 August 2002  

Associated companies :

 

Applicant name :

VANNER, INC.  

Applicant address :

4282 Reynolds Drive, Hilliard, OH 43026  

Old name :

 

Original Source :

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