High pressure high temperature packer system and expansion assembly
A Standard patent application filed on 05 September 2002 credited to Mackay, A. Craig ; Coon, Robert Joe ; Simpson, Neil Andrew Abercrombie ; Lauritzen, J. Eric

Details

Application number :

2002321618  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High pressure high temperature packer system and expansion assembly  

Inventor :

Mackay, A. Craig ; Coon, Robert Joe ; Simpson, Neil Andrew Abercrombie ; Lauritzen, J. Eric  

Agent name :

 

Address for service :

 

Filing date :

05 September 2002  

Associated companies :

 

Applicant name :

WEATHERFORD/LAMB, INC.  

Applicant address :

515 Post Oak Blvd, Suite 600, Houston, TX 77027  

Old name :

 

Original Source :

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