Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing
A Standard patent application filed on 12 July 2002 credited to Chikarmane, Vinay ; Tsang, Chi-Hwa

Details

Application number :

2002320506  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing  

Inventor :

Chikarmane, Vinay ; Tsang, Chi-Hwa  

Agent name :

 

Address for service :

 

Filing date :

12 July 2002  

Associated companies :

 

Applicant name :

INTEL CORPORATION  

Applicant address :

2200 Mission College Boulevard, Santa Clara, CA 95052  

Old name :

 

Original Source :

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