Details

Application number :
2002320506  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing  
Inventor :
Chikarmane, Vinay ; Tsang, Chi-Hwa  
Agent name :
 
Address for service :
 
Filing date :
12 July 2002  
Associated companies :
 
Applicant name :
INTEL CORPORATION  
Applicant address :
2200 Mission College Boulevard, Santa Clara, CA 95052  
Old name :
 
Original Source :
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