Process for producing heat-expandable microcapsule
A Standard patent application filed on 21 June 2002 credited to Omura, Takahiro ; Kawaguchi, Yasuhiro ; Furukawa, Toshiharu

Details

Application number :

2002315844  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Process for producing heat-expandable microcapsule  

Inventor :

Omura, Takahiro ; Kawaguchi, Yasuhiro ; Furukawa, Toshiharu  

Agent name :

 

Address for service :

 

Filing date :

21 June 2002  

Associated companies :

 

Applicant name :

TOKUYAMA SEKISUI CO., LTD.  

Applicant address :

4-4, Nishitenma 2-chome, Kita-ku, Osaka-shi, Osaka 530-8565  

Old name :

 

Original Source :

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