Method and device for inserting inserts while guiding and encapsulating the same by injection molding
A Standard patent application filed on 10 May 2002 credited to Herbst, Richard

Details

Application number :

2002315763  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and device for inserting inserts while guiding and encapsulating the same by injection molding  

Inventor :

Herbst, Richard  

Agent name :

 

Address for service :

 

Filing date :

10 May 2002  

Associated companies :

 

Applicant name :

HEKUMA GMBH  

Applicant address :

Freisinger Strasse 3b, 85386 Eching  

Old name :

 

Original Source :

Go  

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