Apparatus and method for grinding, lapping and polishing semiconductor wafers
A Standard patent application filed on 09 February 2000 credited to Masayuki, Kobayashi

Details

Application number :
23110  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Apparatus and method for grinding, lapping and polishing semiconductor wafers  
Inventor :
Masayuki, Kobayashi  
Agent name :
 
Address for service :
 
Filing date :
09 February 2000  
Associated companies :
 
Applicant name :
Shin-Etsu Handotai Europe Limited  
Applicant address :
 
Old name :
 
Original Source :
Go  

Same Inventor