Method for forming a wafer level chip scale package, and package formed thereby
A Standard patent application filed on 12 June 2002 credited to Chew, Hwee Seng Jimmy
;
Alvarez, Romeo Emmanuel P.
;
Briar, John
Details
Application number :
2002309459
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Method for forming a wafer level chip scale package, and package formed thereby
Inventor :
Chew, Hwee Seng Jimmy
;
Alvarez, Romeo Emmanuel P.
;
Briar, John
Agent name :
Address for service :
Filing date :
12 June 2002
Associated companies :
Applicant name :
ADVANPACK SOLUTIONS PTE LTD
Applicant address :
54 Serangoon North Avenue 4, Singapore 555854, Singapore