Details

Application number :
2002309459  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
Method for forming a wafer level chip scale package, and package formed thereby  
Inventor :
Chew, Hwee Seng Jimmy ; Alvarez, Romeo Emmanuel P. ; Briar, John  
Agent name :
 
Address for service :
 
Filing date :
12 June 2002  
Associated companies :
 
Applicant name :
ADVANPACK SOLUTIONS PTE LTD  
Applicant address :
54 Serangoon North Avenue 4, Singapore 555854, Singapore  
Old name :
 
Original Source :
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