Liquid-cooled power semiconductor device heatsink
A Standard patent application filed on 17 April 2002 credited to Schnetzka, Harold ; Roy, Steven ; Judge, John

Details

Application number :

2002307356  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Liquid-cooled power semiconductor device heatsink  

Inventor :

Schnetzka, Harold ; Roy, Steven ; Judge, John  

Agent name :

 

Address for service :

 

Filing date :

17 April 2002  

Associated companies :

 

Applicant name :

YORK INTERNATIONAL CORPORATION  

Applicant address :

631 South Richland Avenue, York, PA 17403  

Old name :

 

Original Source :

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