Substrate adhesion enhancement to film
A Standard patent application filed on 11 April 2002 credited to Skorupski, Edward C. ; Herrick, Wendy ; Andresakis, John A. ; Gray, Jeffrey T.

Details

Application number :

2002307319  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Substrate adhesion enhancement to film  

Inventor :

Skorupski, Edward C. ; Herrick, Wendy ; Andresakis, John A. ; Gray, Jeffrey T.  

Agent name :

 

Address for service :

 

Filing date :

11 April 2002  

Associated companies :

 

Applicant name :

OAK-MITSUI, INC.  

Applicant address :

80 1st Street, Hoosick Falls, NY 12090  

Old name :

 

Original Source :

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