Multi-layer electrode assembly including a gel-forming polymer and an adhesive resin material
A Standard patent application filed on 14 March 2002 credited to Pekala, Richard W. ; Khavari, Mehrgan

Details

Application number :

2002306737  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Multi-layer electrode assembly including a gel-forming polymer and an adhesive resin material  

Inventor :

Pekala, Richard W. ; Khavari, Mehrgan  

Agent name :

 

Address for service :

 

Filing date :

14 March 2002  

Associated companies :

 

Applicant name :

AMTEK RESEARCH INTERNATIONAL LLC  

Applicant address :

P.O. BOX 39, Lebanon, OR 97355  

Old name :

 

Original Source :

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