High tg acrylic polymer and epoxy-containing blend thereof as pressure sensitive adhesive and method of forming glass or plastic laminates therewith
A Standard patent application filed on 31 May 2002 credited to Mckinney, Kevin J. ; Wigdorski, Robert M. ; Zajaczkowski, Michael J.

Details

Application number :

2002259319  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High tg acrylic polymer and epoxy-containing blend thereof as pressure sensitive adhesive and method of forming glass or plastic laminates therewith  

Inventor :

Mckinney, Kevin J. ; Wigdorski, Robert M. ; Zajaczkowski, Michael J.  

Agent name :

 

Address for service :

 

Filing date :

31 May 2002  

Associated companies :

 

Applicant name :

ADHESIVES RESEARCH, INC.  

Applicant address :

P.O. Box 100, Glen Rock, PA 17327  

Old name :

 

Original Source :

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