Efficient interconnect network for use in fpga device having variable grain architecture
A Standard patent application filed on 09 December 1999 credited to Nguyen, Bai ; Agrawal, Om P. ; Chang, Herman M. ; Wong, Jack T. ; Sharpe-Geisler, Bradley A.

Details

Application number :

21717  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Efficient interconnect network for use in fpga device having variable grain architecture  

Inventor :

Nguyen, Bai ; Agrawal, Om P. ; Chang, Herman M. ; Wong, Jack T. ; Sharpe-Geisler, Bradley A.  

Agent name :

 

Address for service :

 

Filing date :

09 December 1999  

Associated companies :

 

Applicant name :

Lattice Semiconductor Corporation  

Applicant address :

 

Old name :

 

Original Source :

Go