Copper interconnect structure having diffusion barrier
A Standard patent application filed on 05 December 2001 credited to Raaijmakers, Ivo ; Soininen, Pekka J. ; Kim, Ki-Bum

Details

Application number :

2002255441  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Copper interconnect structure having diffusion barrier  

Inventor :

Raaijmakers, Ivo ; Soininen, Pekka J. ; Kim, Ki-Bum  

Agent name :

 

Address for service :

 

Filing date :

05 December 2001  

Associated companies :

 

Applicant name :

ASM INTERNATIONAL N.V.  

Applicant address :

Jan Van Eycklaan 10 NL-3723 BC Bilthoven Netherlands  

Old name :

 

Original Source :

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