Encapsulated die package with improved parasitic and thermal performance
A Standard patent application filed on 26 February 2002 credited to Henricus, Bernadus Antonius Giesen ; Doherty, William E. Jr. ; Kelly, Stephen G. ; Philpot, Kenneth R.

Details

Application number :

2002252090  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Encapsulated die package with improved parasitic and thermal performance  

Inventor :

Henricus, Bernadus Antonius Giesen ; Doherty, William E. Jr. ; Kelly, Stephen G. ; Philpot, Kenneth R.  

Agent name :

 

Address for service :

 

Filing date :

26 February 2002  

Associated companies :

 

Applicant name :

MICROSEMI CORPORATION  

Applicant address :

2381 Morse Avenue, Irvine, CA 92614  

Old name :

 

Original Source :

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