Semiconductor die package having mesh power and ground planes
A Standard patent application filed on 25 February 2002 credited to Cangellaris, Andreas C. ; Ogata, Charley Takeshi ; Wang, Ton-Yong ; Jeon, Myoung-Soo ; Crane, Stanford W. Jr. ; Schutt-Aine, Jose

Details

Application number :

2002252063  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Semiconductor die package having mesh power and ground planes  

Inventor :

Cangellaris, Andreas C. ; Ogata, Charley Takeshi ; Wang, Ton-Yong ; Jeon, Myoung-Soo ; Crane, Stanford W. Jr. ; Schutt-Aine, Jose  

Agent name :

 

Address for service :

 

Filing date :

25 February 2002  

Associated companies :

 

Applicant name :

SILICON BANDWIDTH INC.  

Applicant address :

2890 Zanker Road San Jose, CA 95134 United States of America  

Old name :

 

Original Source :

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