Connector molding method and shielded waferized connector made therefrom
A Standard patent application filed on 23 January 2002 credited to Cohen, Thomas S. ; Astbury, Allan L. Jr.

Details

Application number :

2002251809  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Connector molding method and shielded waferized connector made therefrom  

Inventor :

Cohen, Thomas S. ; Astbury, Allan L. Jr.  

Agent name :

 

Address for service :

 

Filing date :

23 January 2002  

Associated companies :

 

Applicant name :

TERADYNE, INC.  

Applicant address :

321 Harrison Avenue, Boston, MA 02118  

Old name :

 

Original Source :

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Same Inventor

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