Slurry and method for chemical mechanical polishing of copper
A Standard patent application filed on 29 October 2001 credited to Feller, Allen D.
;
Cadien, Kenneth C.
;
Miller, Anne E.
Details
Application number :
2002249848
Application type :
Standard
Application status :
LAPSED
Under opposition :
No
Proceeding type :
Invention title :
Slurry and method for chemical mechanical polishing of copper
Inventor :
Feller, Allen D.
;
Cadien, Kenneth C.
;
Miller, Anne E.
Agent name :
Address for service :
Filing date :
29 October 2001
Associated companies :
Applicant name :
INTEL CORPORATION
Applicant address :
2200 Mission College Boulevard, Santa Clara, CA 95052