A packaging and interconnect system for fiber and optoelectronic components
A Standard patent application filed on 22 January 2002 credited to Nemeth, David Thompson ; Marazita, Steven Michael ; Koh, Philip Joseph

Details

Application number :
2002243598  
Application type :
Standard  
Application status :
LAPSED  
Under opposition :
No  
Proceeding type :
 
Invention title :
A packaging and interconnect system for fiber and optoelectronic components  
Inventor :
Nemeth, David Thompson ; Marazita, Steven Michael ; Koh, Philip Joseph  
Agent name :
 
Address for service :
 
Filing date :
22 January 2002  
Associated companies :
 
Applicant name :
SOPHIA WIRELESS, INC.  
Applicant address :
14225-C Sullyfield Circle, Chantilly, VA 20151  
Old name :
 
Original Source :
Go  

Same Inventor