A slot via filled dual damascene structure without middle stop layer and method for making the same
A Standard patent application filed on 12 December 2001 credited to Gabriel, Calvin T. ; Subramanian, Ramkumar ; Okada, Lynne A. ; Wang, Fei

Details

Application number :

2002241623  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

A slot via filled dual damascene structure without middle stop layer and method for making the same  

Inventor :

Gabriel, Calvin T. ; Subramanian, Ramkumar ; Okada, Lynne A. ; Wang, Fei  

Agent name :

 

Address for service :

 

Filing date :

12 December 2001  

Associated companies :

 

Applicant name :

ADVANCED MICRO DEVICES, INC.  

Applicant address :

One AMD Place, Mail Stop 68, Sunnyvale, CA 94088-3453  

Old name :

 

Original Source :

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