Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control
A Standard patent application filed on 16 January 2002 credited to Sunkara, Raja S. ; Jevtic, Dusan B.

Details

Application number :

2002239964  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control  

Inventor :

Sunkara, Raja S. ; Jevtic, Dusan B.  

Agent name :

 

Address for service :

 

Filing date :

16 January 2002  

Associated companies :

 

Applicant name :

APPLIED MATERIALS, INC.  

Applicant address :

3050 Bowers Avenue, Santa Clara, CA 95054  

Old name :

 

Original Source :

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