High-density flip-chip interconnect
A Standard patent application filed on 01 February 2002 credited to Jamieson, Mark P.

Details

Application number :

2002236936  

Application type :

Standard  

Application status :

LAPSED  

Under opposition :

No  

Proceeding type :

 

Invention title :

High-density flip-chip interconnect  

Inventor :

Jamieson, Mark P.  

Agent name :

 

Address for service :

 

Filing date :

01 February 2002  

Associated companies :

 

Applicant name :

INTEL CORPORATION  

Applicant address :

2200 Mission College Boulevard, Santa Clara, CA 95052  

Old name :

 

Original Source :

Go